教师名录
计红军
通讯地址:深圳市西丽大学城哈工大校区D307
电子邮件:jhj7005@hit.edu.cn
联系电话:+86-755-26033281

个人简介

计红军,1980年7月出生于黑龙江省宾县。1999年考入哈尔滨工业大学焊接系,2003年以专业第一名成绩保送攻读硕士研究生,2005年推荐攻读博士研究生,于2008年8月30日获得工学博士学位。长期从事功率超声在微纳连接、电子封装等领域的基础和应用基础研究,致力于超声与材料表界面的组织-结构-性能相互作用规律的探求、以及超声技术推广应用。近来,同时研究纳米颗粒、纳米线等用于印刷电子、柔性电子及可穿戴领域。欢迎积极进取、踏实勤奋的青年才俊加入课题组。

招生计划:
1. 硕士研究生2-3名,推免生优先;有继续读博兴趣的同学优先;
2. 博士生1-2名(招生专业为材料加工工程,材料科学与工程学科),提供多渠道的国外交流访问和企业实践机会;
3. 博士后1-2名,常年招收,待遇从优。

研究方向

1. 超声加工原理与技术(超声辅助材料制备合成,超声诱发塑性变形,超声无损检测技术等)
2. 表面、界面的微观结构与性能(电子显微分析,包括SEM,TEM等)
3. 新材料连接技术(高性能材料及特种材料,如硬质合金,陶瓷,高强合金,非晶纳米晶等)
4. 先进电子封装互连材料与技术(引线键合,芯片键合等)
5. 可穿戴、柔性传感器(纳米金属颗粒、纳米金属线及其核壳结构的合成、印刷、器件)

教育经历

2005.08-2008.08  哈尔滨工业大学,获工学博士学位(材料加工工程,微纳连接、电子封装方向)
2003.08-2005.07  哈尔滨工业大学,获工学硕士学位(材料加工工程,微纳连接、电子封装方向)
1999.08-2003.07  哈尔滨工业大学,获工学学士学位(材料成型与控制工程,焊接方向)

研究与工作经历

2017.04-至今  哈尔滨工业大学(深圳),材料学院,副教授,博士生导师
2012.08-至今  哈尔滨工业大学深圳研究生院,材料学院,副教授
2010.03  日本国立材料科学研究所,访问学者
2009.11-2012.07  哈尔滨工业大学深圳研究生院,材料学院,助理教授
2008-2009  日本国立材料科学研究所,NIMS博士后研究员

专业资质与学术兼职

2013-至今  中国电子学会 高级会员
2013-至今  美国矿物,金属,材料学会 (TMS-The Minerals, Metals & Materials Society)会员

科研项目

2018-2021  国家自然科学基金面上项目,超声激励氧化铝钎缝原位自生陶瓷相的耐高温接头形成机理研究,主持
2018-2020  广东省自然科学基金自由申请,面向汽车电子的热界面Sn基复合钎料互连原理和性能,主持
2015-2017  广东省自然科学基金自由申请,功率器件封装用陶瓷基板与热沉直接连接新原理,主持
2011-2013  国家自然科学基金青年基金,超声诱发粗晶纯铝细丝塑性孪晶变形机理的透射电镜研究,主持
2012-2014  教育部留学归国人员启动基金,超声作用下微细纯铝丝塑性变形机制研究,主持
2011-2013  深圳市重点实验室提升项目,超声波在新材料/特种材料连接中的共性技术及应用研究,主持
2011-2014  深圳市孔雀计划研发项目,块体非晶及纳米材料的超声波连接关键技术及应用研究,主持

科研成果及奖励

2015  深圳市高层次专业人才
2011  入选首批深圳市海外高层次人才“孔雀计划”

发明专利

18.一种用于射频识别RFID天线导电图案的材料,发明人:计红军,周均博,李明雨,申请号:201711241749.5
17. 一种氧化石墨烯自组装复合银纳米线改善柔性器件机械性能的方法,发明人:计红军,陆骅俊,赵维巍,李明雨,申请号:201710950176.7
16.一种纳米线或纳米器件与纳米金属电极冶金连接的方法,发明人:李明雨,马星,计红军,冯欢欢,张嘉恒,刘钟阳,张玲,王勇,赵维巍,申请号:201710580948.2
15.一种降低纳米金属颗粒烧结温度的方法,发明人:赵维巍,计红军,何鹏,张玲,林铁松,冯欢欢,马星,张嘉恒,李明雨,申请号:201710581612.8
14.一种磁性纳米墨水及磁性柔性电路或器件的制备方法,发明人:何鹏,计红军,林铁松,张玲,冯欢欢,张嘉恒,马星,李明雨,赵维巍,申请号:201710581613.2
13.一种面阵列的封装方法,发明人:马鑫,汪敏,计红军,李明雨,梁孟,黄嘉一,申请号:201710472517.4
12. 用于面阵列封装用铜基非晶焊球及其制备方法及封装方法,发明人:计红军,梁孟,李明雨,马鑫,黄嘉一,申请号:201710442433.6
11. 一种一体式感应熔炼气雾化制粉装置及气雾化制粉的方法,发明人:计红军,周均博,梁孟,陆骅俊,马舒,申请号:201710358256.3
10.一种金属纳米线的定向排布方法,发明人:计红军,陆骅俊,梁孟,周均博,马舒,申请号:201710359450.3
9. 一种互连钎料及其互连成形方法,发明人:计红军,李明刚,申请号:201610847725.3
8. 一种快速生成高熔点接头的芯片键合方法及超声压头设计,发明人:计红军,乔云飞,申请号:201510288396.9,授权日期:2018-03-13
7. 一种大气环境下快速原位生成同质相氧化铝陶瓷的连接方法,发明人:计红军,李明雨,程晓,申请号:201310071412.X,授权日期:2016-01-13
6. 大气环境下硬质材料实现可控间隙连接的方法和该方法使用的模具,发明人:计红军,李明雨,程晓,申请号:201310071404.5,授权日期:2015-11-18.
5. 一种芯片贴装用纳米银浆及其制备方法,发明人:李明雨,王帅,计红军,申请号:201210426581.6,授权日期:2014-08-06.
4. 一种高性能锡基钎料合金及其制备方法,发明人:李明雨,肖勇,计红军,申请号:201110437617.6,授权日期:2014-05-07.
3. 异质金属材料间的钎焊方法,发明人:李明雨,计红军,肖勇,申请号:201110066369.9,授权日期:2013-04-10.
2. 精密部件的电阻热与超声振动复合加热钎焊方法,发明人:王玲,李明雨,王帅,计红军,等,申请号:201010148954.9,授权日期:2012-02-08.
1. 一种面阵封装电子元件的室温超声波软钎焊方法,发明人:李明雨,王晓林,计红军,申请号:200810168269.5,授权日期:2011-12-28.
3. 异质金属材料间的钎焊方法,发明人:李明雨,计红军,肖勇,申请号:201110066369.9,授权日期:2013-04-10.
2. 精密部件的电阻热与超声振动复合加热钎焊方法,发明人:王玲,李明雨,王帅,计红军,等,申请号:201010148954.9,授权日期:2012-02-08.
1. 一种面阵封装电子元件的室温超声波软钎焊方法,发明人:李明雨,王晓林,计红军,申请号:200810168269.5,授权日期:2011-12-28.

论文及著作

参编译著:
1. 《微连接与纳米连接》,机械工业出版社,2010

发表代表性论文:
ResearcherID: K-1107-2013
ORCID:http://orcid.org/0000-0002-4159-6838

33. Hongjun Ji, Junbo Zhou,Meng Liang, Huajun Lu,Mingyu Li,Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging, Ultrasonics Sonochemistry, 2018, 41: 375-381.(JCR Q1,Impact factor:6.012)
https://doi.org/10.1016/j.ultsonch.2017.10.003

32. Hongjun Ji, Hao Chen, Mingyu Li, Overwhelming reaction enhanced by ultrasonics during brazing of alumina to copper in air by Zn-14Al hypereutectic filler, Ultrasonics Sonochemistry, 2017, 35: 61-71.(JCR Q1,Impact factor:6.012)
https://doi.org/10.1016/j.ultsonch.2016.09.003

31. Hongjun Ji, Hao Chen, Mingyu Li, Effect of ultrasonic transmission rate on microstructure and properties of the ultrasonic-assisted brazing of Cu to alumina, Ultrasonics Sonochemistry, 2017, 34: 491-495.(JCR Q1,Impact factor:6.012)
http://dx.doi.org/10.1016/j.ultsonch.2016.06.031

30. C. Zhang, S. Pei, H. Ji*, Y. Cui and M. Li, Fabrication of Ni60–SiC coating on carbon steel for improving friction, corrosion properties, Materials Science and Technology, 2017, 33: 446-453.(JCR Q2,Impact factor:1.803)
http://dx.doi.org/10.1080/02670836.2016.1224216

29. Hongjun Ji, Jiao Wang, Mingyu Li, Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging, Microelectronics Reliability, 2016, 66: 134-142.(JCR Q3,Impact factor:1.236)
http://dx.doi.org/10.1016/j.microrel.2016.10.003

28. Jingdong Liu,Hongtao Chen, Hongjun Ji, Mingyu Li, Highly Conductive Cu?Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles, ACS Applied Materials and Interfaces, 2016, 8: 33289-33298.(JCR Q1,Impact factor:8.097)
http://pubs.acs.org/doi/10.1021/acsami.6b10280

27. Jingdong Liu, Hongjun Ji, Shuai Wang, Mingyu Li, The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink, Journal of Materials Science: Materials in Electronics, 2016, 27: 13280-13287.(JCR Q3,Impact factor:2.324)
https://link.springer.com/content/pdf/10.1007%2Fs10854-016-5476-3.pdf

26. Hongjun Ji, Xiao Cheng, Mingyu Li, Ultrafast ultrasonic-assisted joining of bare α-alumina ceramics through reaction wetting by aluminum filler in air, Journal of the European Ceramic Society, 2016, 36: 4339-4344. (JCR Q1,Impact factor:3.794)
http://dx.doi.org/10.1016/j.jeurceramsoc.2016.06.028

25. Hongjun Ji, Minggang Li, Shu Ma, Mingyu Li, Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging. Materials and Design, 2016, 108: 590-596.(JCR Q1,Impact factor:4.525)
http://dx.doi.org/10.1016/j.matdes.2016.07.027

24. Ming Yang, Hongjun Ji, Shuai Wang, Yong-Ho Ko, Chang-Woo Lee, Jianxin Wu, Mingyu Li, Effects of Ag content on the interfacial reactions between liquid Sn-Ag-Cu solders and Cu substrates during soldering, Journal of Alloys and Compounds, 2016, 679: 18-25.(JCR Q1,Impact factor:3.779)
http://dx.doi.org/10.1016/j.jallcom.2016.03.177

23. Ming Yang, Shihua Yang, Hongjun Ji, Yong-Ho Ko, Chang-Woo Lee, Jianxin Wu, Mingyu Li, Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method, Journal of Materials Processing Technology 2016, 236: 84-92.(JCR Q1,Impact factor:3.647)
http://dx.doi.org/doi:10.1016/j.jmatprotec.2016.04.019

22. Hongjun Ji, Yufei Qiao, Mingyu Li, Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application. Scripta Materialia 2016, 110: 19-23.(JCR Q1,Impact factor:4.163)
http://dx.doi.org/10.1016/j.scriptamat.2015.07.036

21. Hongjun Ji, Qiang Wang, Mingyu Li, Microstructural evolution of lead-free solder joints in ultrasonic-assisted soldering. Journal of Electronic Materials 2016, 45: 88-97.(JCR Q3,Impact factor:1.566)
https://doi.org/10.1007/s11664-015-4108-7

20. Hongjun Ji, Yuyou Ma, Mingyu Li,Chunqing Wang,Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering,Journal of Electronic Materials 2015, 44: 733-743.(JCR Q3,Impact factor:1.566)
http://dx.doi.org/10.1007/s11664-014-3516-4

19. Hongjun Ji, Long Li, Mingyu Li, Low-temperature joining of Fe-based amorphous foil with aluminum by ultrasonic-assisted soldering with Sn-based fillers. Materials and Design 2015, 84: 254-260.(JCR Q1,Impact factor:4.525)
http://dx.doi.org/10.1016/j.matdes.2015.06.112

18. Hongjun Ji, Long Li, Lijie Wang, Mingyu Li, Microstructures and properties of the Fe-based amorphous foil/aluminum dissimilar joint by ultrasonic-assited soldering. Welding in the World 2015, 59: 623-628.(JCR Q3,Impact factor:1.206)
http://dx.doi.org/10.1007/s40194-015-0237-0

17. Hongjun Ji, Junzhao Wanga, Mingyu Li, Evolution of the bulk microstructure in 1100 aluminum builds fabricated by ultrasonic metal welding. Journal of Materials Processing Technology 2014, 214: 175-182.(JCR Q1,Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2013.09.005

16. Hongjun Ji, Shuai Wang, MingyuLi, Jongmyung Kim. Deep crystallization induced high thermal conductivity of low-temperature sintered Ag nanoparticles. Materials Letters 2014, 116: 219-222.(JCR Q2,Impact factor:2.687)
http://dx.doi.org/10.1016/j.matlet.2013.11.030

15. Hongjun Ji, Qiang Wang, Mingyu Li, Chunqing Wang.Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification.Journal of Electronic Materials 2014, 43: 2467-2478.(JCR Q3,Impact factor:1.566)
http://dx.doi.org/10.1007/s11664-014-3113-6

14. YongXiao, HongjunJi, MingyuLi, Jongmyung Kim. Ultrasound-induced equiaxial ower-like CuZn5/Al composite microstructure formation in Al/Zn–Al/Cu joint. Materials Science & Engineering A 2014, 594: 135-139.(JCR Q1,Impact factor:4.432)
http://dx.doi.org/10.1016/j.msea.2013.11.063

13. Hongjun Ji, Qiang Wang, Mingyu Li, Chunqing Wang. Effects of ultrasonic irradiation and cooling rate on the solidification microstructure of Sn–3.0Ag–0.5Cu alloy. Journal of Materials Processing Technology 2014, 214: 13-20.(JCR Q1,Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2013.07.013

12. Yong Xiao, Hongjun Ji, Mingyu Li, Jongmyung Kim. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials & Design 2013, 52: 740-747.(JCR Q1,Impact factor:4.525)
http://dx.doi.org/10.1016/j.matdes.2013.06.016

11. Shuai Wang, Mingyu Li, Hongjun Ji. Chunqing Wang. Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scripta Materialia 2013, 69: 789-792.(JCR Q1,Impact factor:4.163)
http://dx.doi.org/10.1016/j.scriptamat.2013.08.031

10.Yong Xiao, Hongjun Ji, Mingyu Lia, etc. Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn–Al hypereutectic filler metal. Materials & Design 2013, 47: 717–724.(JCR Q1,Impact factor:4.525)
http://dx.doi.org/10.1016/j.matdes.2013.01.004

9. Hongjun Ji, Mingyu Li, Yongfei Lu, Chunqing Wang. Mechanical properties and microstructures of hybrid ultrasonic resistance brazing of WC-Co/BeCu, Journal of Materials Processing Technology, 2012, 212:1885-1891.(JCR Q1,Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2012.04.012

8. Shuai Wang, Hongjun Ji, Mingyu Li, Chunqing Wang, Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles, Materials Letters, 2012, 85:61-63.(JCR Q2,Impact factor:2.687)
http://dx.doi.org/10.1016/j.matlet.2012.06.089

7. Hongjun Ji, Mingyu Li, etc, In situ Measurement of Bond Resistance Varying with Process Parameters during Ultrasonic Wedge Bonding. Journal of Materials Processing Technology, 2009, 209(1): 139-144.(JCR Q1,Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2008.01.036

6. Hongjun Ji, Mingyu Li, etc, Nano Features of Al/Au Ultrasonic Bond Interface Observed by High Resolution Transmission Electron Microscope. Materials Characterization. 2008, 59: 1419-1424.(JCR Q2,Impact factor:2.892)
http://dx.doi.org/10.1016/j.matchar.2008.01.001

5. Heeseon Bang, Hongjun Ji, Mingyu Li, etc. Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-off Method. Materials Science Forum. 2008, 580-582: 173-176.

4. Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Comparison of Interface Evolution of Ultrasonic Aluminum and Gold Wire Wedge Bonds during Thermal Aging. Materials Science & Engineering A, 2007,447 (1-2): 111-118.(JCR Q1,Impact factor:4.432)
http://dx.doi.org/10.1016/j.msea.2006.10.105

3. Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Evolution of the Bond Interface during Ultrasonic Al–Si Wire Wedge Bonding Process. Journal of Materials Processing Technology, 2007,182 (1-3):202-206.(JCR Q1,Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2006.07.033

2. Mingyu Li , Hongjun Ji, Chunqing Wang, etc. Interdiffusion of Al–Ni System Enhanced by Ultrasonic Vibration at Ambient Temperature. Ultrasonics. 2006, 45(1-4): 61-65.(JCR Q2,Impact factor:2.377)
http://dx.doi.org/10.1016/j.ultras.2006.06.058

1. Mingyu Li, Hongjun Ji, Chunqing Wang, etc. Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding. Jounal of Materials Science & Technology 2006, 22(4): 483-486.(JCR Q1,Impact factor:3.609)
https://doi.org/10.1016/j.jmatprotec.2006.07.033

会议论文及发表演说

27.Hongjun Ji, Mingyu Li. Mechanism of ultrasonic-assisted sintering of Cu@Ag NPs paste in air for high-temperature power device packaging. The 7th East Asia Symposium on Technology of Welding and Joining (7th EAST-WJ), Hangzhou, China, Oct. 31 - Nov.1, 2017.(Oral)

26. Hongjun Ji, Mingyu Li. Rapid formation of intermetallic joint during ultrasonic assisted soldering of Sn-based composite solders. 2017 Materials Science and Technology (MS&T17), Pittsburgh, Pennsylvania, USA, Oct. 8-12, 2017.(Oral)

25. Shu Ma, Hongjun Ji*, Junbo Zhou, Huajun Lu, Meng Liang, Minggang Li, Mingyu Li.Rapid Formation of Intermetallic Joints with Sn/Metal Composite Alloys by Ultrasonic-assisted Soldering for High-temperature Chip Attachment. IEEE 2017 International Conference on Electronic Packaging Technology, Harbin, China, Aug.16-19, 2017.(Oral)

24. Hongjun Ji, Mingyu Li. Ultrasonic-induced intermetallic joint with Sn-based solders for high-temperature high-power device packaging. 70th IIW Annual Assembly & International Conference, Shanghai, China, June 25-30, 2017.(Oral)

23. Hongjun Ji, Mingyu Li. Mechanism for Rapid Intermetallic Joint Formation during Ultrasonic-assisted Soldering of Sn-based Composite Solders, International Welding/Joining Conference-Korea (IWJC-Korea 2017), HICO, Gyeongju, South Korea, April 11-14, 2017.(Oral)

22. Hongjun Ji, Minggang Li, Mingyu Li. Ultrasonic-assisted soldering of Sn/Ni composite solder during die bonding for high-temperature application. IEEE 2016 International Conference on Electronic Packaging Technology, Wuhan, China, Aug.16-19, 2016.(Poster)

21. Hongjun Ji, Mingyu Li, Yunfei Qiao. Ultrasonic-assisted soldering of Sn-based solder alloys to form intermetallic interconnects for high temperature application. ECTC, Las Vegas, NV, USA, May 31-June 3, 2016.(Oral)

20. Hongjun Ji. Effects of Ultrasonic Vibration on Undercooling and Microstructures of SAC305 Alloy Solder Joints. 2015 Materials Science and Technology (MS&T15), Columbus, OH, USA, Oct. 4-8, 2015.(Oral)

19. Hongjun Ji, Yunfei Qiao, Mingyu Li. Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application. IEEE 2015 International Conference on Electronic Packaging Technology, Changsha, China, Aug.11-14, 2015.(Oral)

18. Hongjun Ji, Mingyu Li. Progress in ultrasonic-assisted soldering/brazing for joining hard wetted materials. The Fifth East Asia Symposium of Welding and Joining (5th EAST-WJ), Hokkaido, Japan, Sep. 2-3, 2015.(Oral)

17. Hongjun Ji, Hao Chen, Mingyu Li. Microstructures and properties of alumina/copper joints fabricated by ultrasonic-assisted brazing for replacing DBC in power electronics packaging, IEEE 2014 International Conference on Electronic Packaging Technology, Chengdu, China, Aug.12-15, 2014.(Oral)

16.Hongjun Ji, Long Li, Lijie Wang, Mingyu Li. Microstructures and Properties of the Fe-based Amorphous Foil/Aluminum Dissimilar Joint by Ultrasonic-assisted soldering. International Conference on Brazing, Soldering and Special Joining Technologies, Beijing, China, June 9-13, 2014.(Oral)

15. Hongjun Ji, Mingyu Li. Effect of Silver Content in SAC Solder on the Interfacial Reaction and Reliability of the Angle Joints Fabricated by Laser-jet Soldering. 2014 TMS Annual Meeting & Exhibition, SanDiego, FL, US, Feb. 16-20, 2014.(Oral)

14.Hongjun Ji, Xiao Cheng, Hao Chen, et al. Direct Bonding of Alumina Substrate with Copper Heat Sink in Air Assisted by Ultrasonic vibrations for High Power LEDs Devices. IEEE 2013 International Conference on Electronic Packaging Technology, Dalian, China, Aug.11-14, 2013.(Poster)

13. Shuai Wang, Hongjun Ji, Mingyu Li, et al. Pressureless low temperature sintering of Ag nanoparticles for interconnects. 2012 14th International Conference on Electronic Materials and Packaging, HongKong, Dec. 12-16, 2012. (Oral)

12. Hongjun Ji, Junzhao Wang, Mingyu Li. Microstructure evolution of 1100 Al alloy multi-foils during ultrasonic additive manufacturing. IEEE 2012 International Conference on Electronic Packaging Technology, Guilin, China, Aug.13-16, 2012.(Poster)

11. Hongjun Ji, Qiang Wang, Mingyu Li. Effects of ultrasonic vibrations on undercooling and microstructures. IEEE 2012 International Conference on Electronic Packaging Technology, Guilin, China, Aug.13-16, 2012.(Oral)

10. Hongjun Ji, Mingyu Li, Chunqing Wang. Ultrasonic-induced deformation nanostructures in coarse-grained aluminum wires at room termperature. IEEE 2012 International Conference on Electronic Packaging Technology, Guilin, China, Aug.13-16, 2012.(Oral)

9. Hongjun Ji, Masahiko Demura, etc. Diffusion Bonding of Boron-free Ni3Al Foils without Interlayer. The 2009 Autumn Meeting of The Japan Institute of Metals, University of Kyoto, Kyoto, Japan, 2009.(Oral)

8. Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Nanoscale Analysis of Ultrasonic Wedge Bond Interface by Using High-Resolution Transmission Electron Microscopy. IEEE 2008 International Conference on Electronic Packaging Technology & High Density Packaging,Shanghai, China, Aug. 28-31, 2008.(Oral, Best paper)

7. Hongjun Ji, Mingyu Li, etc. Observation of Ultrasonic Al-Si Wire Wedge Bond Interface Using High Resolution Transmission Electron Microscope. IEEE 2007 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.15-17, 2007. (Oral)

6. Han Sur Bang, Hongjun Ji, Mingyu Li, Chunqing Wang. Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-off Method. International Welding/Joining Conference-Korea 2007, Seoul, Korea, May 10-12, 2007.

5. Mingyu Li, Hongjun Ji, Chunqing Wang. Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding. 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006.

4. Hongjun Ji, Mingyu Li, Chunqing Wang. Interfacial Characterization and Bonding Mechanism of Ultrasonic Wedge Bonding. IEEE 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.26-29, 2006: 457-46.(Oral)

3. Mingyu Li, Song Li, Hongjun Ji. Metallurgical Behavior of Au/Al Bond Interface during High Temperature Storage of Ultrasonic Wedge Bonding. IEEE 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.26-29, 2006: 641-644.

2. Mingyu Li, Jingwei Guan, Hongjun Ji. Study on Optimized Processing Parameters and Joint Resistance of Device during Ultrasonic Bonding. IEEE 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.26-29, 2006: 280-282.

1. Ji Hongjun, Li Mingyu, Wang Chunqing. The Diffusion of Ni into Al Wire at the Interface of Ultrasonic Wire Bond during High Temperature Storage. IEEE 2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China, Aug.31-Sep.2, 2005: 377-381. (Oral)

任教和任导师经历

哈尔滨工业大学(深圳),材料科学与工程学院  授课:
主讲课程《电子封装互连方法》;与其他老师合上课程《先进材料表征技术》,负责TEM部分的讲授。

指导硕士研究生情况:
2017级:
1. 鱼家傲,女,本科哈工大本部,在读;
2. 潘浩,男,本科武汉理工大学,在读;

2016级:
1. 刘昊,研究方向:纳米颗粒及其印刷性能,女,本科哈工大本部,在读;
2. 黄嘉一,研究方向:功率器件芯片封装UTLP,男,本科华南理工大学,在读;
3. 尹凡奇,研究方向:纳米线及其传感器制备,男,本科哈工大校本部,在读;

2015级:
1. 梁孟,男,本科哈工大校本部,研究方向:气雾化法制备微米金属颗粒(化合物、非晶),毕业第一去向:西门子(深圳)磁共振有限公司;
2. 马舒,男,本科三峡大学,研究方向:SnBi钎料复合钎料,毕业第一去向:深圳市高新投集团;
3. 陆骅俊,男,本科哈工大校本部,研究方向:纳米线及柔性传感器,毕业第一去向:华星光电;
4. 周均博,男,本科燕山大学,研究方向:纳米颗粒及其在功率、印刷器件上的应用,毕业第一去向:华为;

2014级:
1. 裴帅,女,本科哈工大校本部,毕业第一去向:华为;
2. 吕潇雅,女,本科哈工大威海,毕业第一去向:南京55所;
3. 张长安,男,本科哈工大校本部,毕业第一去向:华为;
4. 李明刚,男,本科河北科技大学,毕业第一去向:国微电子;
5. 曹恒振,男,本科哈工大威海,毕业第一去向:沙钢投资;

2013级:
1. 王娇,女,本科哈工大威海,毕业第一去向:华为;
2. 王哲,男,本科哈工大校本部,毕业第一去向:汇顶科技;
3. 乔云飞,男,本科哈工大威海,毕业第一去向:华为;
4. 卢志平,男,本科哈工大威海,毕业第一去向:深信服;
5. 何气敬,男,本科哈工大校本部,毕业第一去向:华为;

2012级:
1. 王荔洁,女,本科哈工大校本部,毕业第一去向:中兴通讯;
2. 陈昊,男,本科哈工大威海,毕业第一去向:校本部读博;
3. 徐龑,男,本科南京理工大学,毕业第一去向:校本部读博;
4. 李天亮,男,本科哈工大校本部,毕业第一去向:长客;
5. 陈上杭,男,本科哈工大校本部,毕业第一去向:武汉铁锚;

2011级:
1. 崔洋,男,本科哈工大校本部,毕业第一去向:华晨宝马;
2. 李龙,男,本科重庆大学,毕业第一去向:华为;
3. 程晓,男,本科湘潭大学,毕业第一去向:xx;
4. 李延林,男,本科吉林大学,毕业第一去向:长客;
5. 陆思源,男,本科哈工大校本部,毕业第一去向:南南铝业;

2010级:
1. 翟明智,男,本科哈工大威海,毕业第一去向:南京55所;
2. 马昱友,男,本科哈工大威海,毕业第一去向:大连华锐;
3. 王君兆,男,本科燕山大学,毕业第一去向:美信检测;
4. 麦成乐,男,本科哈工大校本部,毕业第一去向:继续读博;
最后更新:2018-09-12 11:10:04